The Rework Station facilitates the reliable and precise rework of BGA, CSP and QFN-components, connectors and sockets. Innovative technologies such as Advanced Vision Placement, Hybrid Heating Technology and the intuitively operated Easy Solder software ensure safe soldering and de-soldering without the intervention of operators in the soldering process. These compact rework stations are, in addition to soldering and de-soldering, suitable for removing residual solder and for dispensing fluxes and solder pastes. With the software Easy Solder all rework profiles are easily managed. The Expert 10.6 product family offers a comprehensive selection of Hybrid and IR Under heaters to ensure ideal conditions for the different rework applications.

Manual Rework:

The Expert 04.6 equipment family provides optimal support in the manual rework station environment. Designed to provide all the function required for Rework, ergonomically arranged in a very compact space, the unit incorporates: heating, residual solder removal and dispensing. The heating technology employed guaranties exemplary soldering results. The compact workstations are in addition to soldering and de-soldering, also able to remove residual solder and dispense fluxes and solder pastes. With the software Easy Solder all profiles for rework processes are clearly managed. Hybrid as well as IR Under heaters are available with the product family Expert 04.6 to ensure ideal conditions for different applications. The precise and highly efficient hot air top heating is an important component in any variant of the Expert 04.6 range of workstations. Top and bottom heating is automatically adjusted to the required parameters by the included auto profiler.

Applications for Underheater range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of under fill. They can be classified by size of the heater and heater performance. For small boards IR systems are available up to a power rating of 2.000 W. For medium sized boards and above Hybrid heaters between 3.000 and 10.000 W are on offer. Hybrid Underheaters can be augmented with additional functions, such as Hot Gas top heating, residual solder removal and Positioning Arm.

The Mini oven 04 provides a fully-fledged reflow environment in a very compact form. This tabletop equipment is ideal for Pre-Bumping of QFNs and also for Reballing of BGAs and CSPs. Perfect temperature management is foremost. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. For especially stringent demands for the highest soldering quality the Mini oven is also available with a gas connection for processing gases, such as nitrogen, argon and formic.The Mini oven is controlled via an intuitive menu from the display. Up to 99 profiles, through the system software component specifically adjusted, can be stored.